Laser scribing by Laser Cutting

Accurate and reliable scribing to customer specifications

Laser-scribed substrates are normally supplied without tooling or computer part program costs.

depth of scribing normally 30 - 50% of material thickness (or by arrangement)
laser pulse spacing normally 0.15+/-0.02 mm centreline to centreline (or by arrangement)
edge to design. Border edge to be snapped off should be at least 5 times material thickness
length and width between scribed edges +0.15/-0.05mm
laser-scribed/laser-profiled edge to first scribe line +0.15/-0.05 mm
scribe line to scribe line +/- 0.05 mm

Laser scribing

		SCRIBING Accurate and reliable scribing to customer specifications Laser-scribed substrates are normally supplied without tooling or computer part program costs. depth of scribing normally 30 - 50% of material thickness (or by arrangement) laser pulse spacing normally 0.15+/-0.02 mm centreline to centreline (or by arrangement) edge to design. Border edge to be snapped off should be at least 5 times material thickness length and width between scribed edges +0.15/-0.05mm laser-scribed/laser-profiled edge to first scribe line +0.15/-0.05 mm scribe line to scribe line +/- 0.05 mm Drilling Profiling Additional Design Guidelines